| Function Type: | Thermal Imaging System |
|---|---|
| Detection Type: | Microbolometer |
| Output Signal Type: | Digital Type |
| Production Process: | SemiConductor Integrated |
| Material: | VOx |
| IP Rating: | None |
| Customization: |
|---|
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COIN417 uncooled infrared module uses the fully optimized SWaP-C wafer level package (WLP) infrared imaging detector with 400x300 resolution and 17μm pixel size. It also has an optional thermographic function with measurement range from -20ºC~550 ºC for industrial temperature measurement.
Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.
The COIN417 infrared module features in sharp and crisp thermal image presentation, compact size and low cost. Its lightweight and flexible features with various industry standard interfaces make it popular in infrared applications such as Security & Surveillance, UAV Payloads, Advanced Driver Assistant System, Firefighting, AIoT etc.
Main Features:
- Mini Size: 25.4x25.4x14.1mm
- Light Weight
- NETD<40mk
- High Quality Image
- Low Power Consumption
- Rapid Development & Integration
|
Model |
COIN417/R |
|
IR Detector Performance |
|
|
Resolution |
400X300 |
|
Pixel Pitch |
17μm |
|
Spectral Range |
8~14μm |
|
NETD |
<40mk |
|
Image Processing |
|
|
Frame Rate |
25Hz/30Hz/50Hz/60Hz |
|
Start-up Time |
≤10S |
|
Analog Video |
PAL/NTSC |
|
Digital Video |
RAW/YUV/BT656 |
|
Dimming Mode |
Linear/Histogram/Mixed |
|
Digital Zoom |
1~8X Continual Zoom, Step Size 1/8 |
|
Image Display |
Black Hot/White Hot/Pseudo Color |
|
Image Direction |
Horizontally/Vertically/Diagonally Flip |
|
Image Algorithm |
NUC/AGC/IDE/DNR |
|
Electrical Specification |
|
|
Standard External Interface |
30pin_HRS |
|
Communication Mode |
RS232-TTL, 115200bps |
|
Supply Voltage |
3.5~5.5V |
|
Typical Power Consumption |
<1.1W |
|
Temperature Measurement |
|
|
Operating Temperature Range |
-10ºC~50ºC |
|
Temperature Measurement Range |
-20ºC~150ºC, 100ºC~550ºC |
|
Temperature Accuracy |
±3ºC/±3% (Take the Maximum Value) |
|
SDK |
Support ARM/Windows/Linux SDK, Full Screen Thermography |
|
Physical Characteristics |
|
|
Dimension (mm) |
25.4X25.4X14.1 (With Shutter) |
|
Weight |
13g±0.5g (Without Lens) |
|
Environmental |
|
|
Operation Temperature |
-40°C ~ +70°C |
|
Storage Temperature |
-45°C ~ +85°C |
|
Humidity |
5%~95%, Non-condensing |
|
Vibration |
Random Vibration 5.35grms, 3 Axis |
|
Shock |
Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
|
Optics |
|
|
Optional Lens |
Fixed Focus Athermal: 9.7mm/15mm/19mm |
Applications:
1.What is infrared detector / thermal imaging sensor?
Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.
2.What is WLP?
WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.
3. What's the advantage of WLP?
WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. Global Sensor Technology, with volume fabrication capability, is now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.
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